TechTaffy

tech:

taffy

Intel Unveils New Technologies For Foundry Customers

By TechTaffy Desk

Intel

Intel has released two new technologies for its custom foundry customers. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, enables a lower cost and simpler 2.5D packaging approach for high density interconnects between heterogeneous dies on a single package, says Intel.

The chipmaker  also announced the availability of its High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel’s test technology platform that targets a range of products including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products.

EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.

[Image courtesy: Intel]

Just in

Seed

Oso Semiconductor raises $5.2M

Oso Semiconductor has raised $5.2 million in seed funding. The round was led by Engine Ventures.
People

Battelle appoints Tim Ryan to board of directors

Battelle has elected Tim Ryan, Citi’s Head of Technology and Business Enablement, to its board of directors.
Around the web

OpenAI launches ChatGPT Gov for U.S. government agencies — CNBC

It’s called ChatGPT Gov and was built specifically for U.S. government use; writes Hayden Field. 
Around the web

DeepSeek’s popular AI app is explicitly sending US data to China — Wired

Users have already reported several examples of DeepSeek censoring content that is critical of China or its policies, writes Matt Burgess and Lily Hay Newman. 
Around the web

DeepSeek hit with large-scale cyberattack, says it’s limiting registrations — CNBC

DeepSeek on Monday said it would temporarily limit user registrations “due to large-scale malicious attacks” on its services; writes Hayden Field.