Intel has released two new technologies for its custom foundry customers. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, enables a lower cost and simpler 2.5D packaging approach for high density interconnects between heterogeneous dies on a single package, says Intel.
The chipmaker also announced the availability of its High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel’s test technology platform that targets a range of products including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products.
EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.
[Image courtesy: Intel]