TechTaffy

tech:

taffy

Wireless Glue Raises $4.5M Series B Round

By TechTaffy Desk

Wireless Glue has closed a Series B round of $ 4.5 million. Investors include Japanese firms, Innovation Network Corporation of Japan, Toko Electric Corporation, Hosiden Corporation, and US venture capital firm, Clean Pacific Ventures.

Wireless Glue is a United States-based company with offices in Japan that delivers software and hardware solutions that capture and deliver energy data in real-time for the commercial and Industrial market.

Just in

AI

DHS establishes AI safety and security board

The Department of Homeland Security (DHS) has established an Artificial Intelligence Safety and Security Board (the board). The inaugural members include CEOs and executives from companies like OpenAI, Anthropic, Delta Air Lines, IBM, Nvidia, Microsoft, Adobe, Amazon Web Services, Advanced Micro Devices (AMD), and Cisco.
IT

Cloudflare acquires Baselime

Cloudflare has acquired Baselime, a cloud-native observability platform provider. Financial terms of the deal were not disclosed.
Fundings

Blaize raises $106M

El Dorado Hills, CA-based AI computing company Blaize has raised $106 million.
Fundings

Rivos raises $250M

Santa Clara, Calif.-based Rivos, a RISC-V accelerated platform company focusing on data analytics and Generative AI, has raised $250 million in its Series A-3 funding round
Industry

IBM, Canada, and Quebec invest $137M to strengthen semiconductor industry

IBM, the Government of Canada, and the Government of Quebec announced agreements to develop the assembly, testing and packaging capabilities for semiconductor modules at IBM Canada's plant in Bromont, Quebec.