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Wireless Glue Raises $4.5M Series B Round

[Techtaffy Newsdesk]

Wireless Glue has closed a Series B round of $ 4.5 million. Investors include Japanese firms, Innovation Network Corporation of Japan, Toko Electric Corporation, Hosiden Corporation, and US venture capital firm, Clean Pacific Ventures.

Wireless Glue is a United States-based company with offices in Japan that delivers software and hardware solutions that capture and deliver energy data in real-time for the commercial and Industrial market.

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