Rambus signs license agreement with Beijing Tongfang Microelectronics

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Rambus has signed a patent license agreement with Beijing Tongfang Microelectronics, a fabless chip design company focusing on smart cards and related technologies. The agreement includes the use of Rambus patents such as Differential Power Analysis (DPA) Countermeasures, which protect devices and integrated circuits against DPA and other related side-channel attacks.

Specific terms of the agreement are confidential.

[Image courtesy: Rambus]