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HomeAround the webQualcomm bumps top smartphone chip in preparation for fall -- Gizmodo

Qualcomm bumps top smartphone chip in preparation for fall — Gizmodo

The new Snapdragon 855 Plus features refreshed specs including new Qualcomm Kyro 485 Prime CPU cores with improved clock speeds, writes Sam Rutherford.

Here is the link: https://gizmodo.com/qualcomm-bumps-top-smartphone-chip-in-preparation-for-f-1836376345