Intel and United Microelectronics Corporation (UMC) have announced a collaboration to develop a 12-nanometer semiconductor process platform. This platform aims to cater to markets such as mobile, communication infrastructure, and networking. The agreement combines Intel’s manufacturing capacity in the U.S. with UMC’s experience in mature node foundry processes.

The 12 nm node will utilize Intel’s manufacturing capacity and FinFET transistor design in the U.S. The process will be developed and manufactured in Intel’s Fabs 12, 22, and 32 at the Ocotillo Technology Fabrication site in Arizona, leveraging existing equipment to optimize utilization.

The production of the 12 nm process is expected to begin in 2027.

[Image courtesy: Intel]