Intel plans new semiconductor assembly and test facility in Poland

Intel announced plans to build a new semiconductor assembly and test facility near Wrocław, Poland. An investment of up to $4.6 billion is expected to go into the facility.

Design and planning for the facility will start immediately, with construction set to begin upon receiving approval from the European Commission. Upon completion, Intel plans to employ approximately 2,000 people at the site.

Assembly and test facilities such as the one planned for Poland receive completed wafers, cut them into individual chips, assemble them into final products, and test them for performance and quality. This facility will also be able to process individual chips and is designed to be compatible with wafers and chips from Intel, Intel Foundry Services, or other foundries.

Intel says it aims to meet the predicted demand for assembly and test capacity by 2027 through this project.

[Image courtesy: Intel]

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