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GE Unveils New Rugged COM Express Module

By TechTaffy Desk

[Techtaffy Newsdesk]

GE Intelligent Platforms has unveiled the bCOM6-L1200 Rugged Type 6 COM Express Module. The bCOM6-L1200 is ideal for OEMs designing computing platforms into equipment for industrial or harsh environments, says GE.

By separating the carrier card from the processor, the bCOM6-L1200’s COM Express architecture extends the useful life of the subsystem by allowing upgrade of the processor alone. On-board components are specifically selected for their reliability in demanding conditions, and, unlike solutions designed for benign environments, processor and memory are soldered to the board for maximum resistance to shock and vibration. Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes.

[Image Courtesy: GE]

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