TSMC, Robert Bosch, Infineon Technologies, and NXP Semiconductors have announced plans to jointly invest in the European Semiconductor Manufacturing Company (ESMC), located in Dresden, Germany. The total investments for the venture are expected to exceed 10 billion euros. TSMC will be responsible for operating the fabrication facility.
In terms of ownership, the planned joint venture will see TSMC holding 70% of the stakes, while Bosch, Infineon, and NXP will each hold 10%, subject to regulatory approvals and other conditions.
The joint investment in ESMC is significant in paving the way for the construction of a 300mm fabrication facility. The planned facility is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers using TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology. Additionally, the facility aims to be utilizing advanced FinFET transistor technology and is expected to create about 2,000 direct high-tech professional jobs.
The construction of the fabrication facility is set to begin in the second half of 2024, with production aimed to start by the end of 2027.
The investment aims to provide advanced semiconductor manufacturing services and support the future capacity needs of the automotive and industrial sectors, the companies said in a statement. The final investment decision is pending confirmation of public funding for the project, and it aligns with the framework of the European Chips Act.
[Image courtesy: Bosch]