Home Industry Intel opens Fab 9 semiconductor packaging factory in New Mexico

Intel opens Fab 9 semiconductor packaging factory in New Mexico

A drone photo shows Intel's new Fab 9 in Rio Rancho, New Mexico, in January 2024. Fab 9 is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies. (Credit: Intel Corporation)

Intel celebrated the opening of Fab 9, its new factory in Rio Rancho, New Mexico. The new factory represents Intel’s first major semiconductor operation in the U.S. and is the only factory in the country producing advanced packaging solutions at this scale.

Fab 9 is part of Intel’s $3.5 billion investment aimed at upgrading its New Mexico operations. The Fab 9 and Fab 11x facilities in Rio Rancho are the first sites for the mass production of Intel’s 3D advanced packaging technology. Fab 9 also represents Intel’s first high-volume advanced packaging site where the entire manufacturing process, from demand to final product, is co-located.

Intel’s investment in Rio Rancho is credited with creating hundreds of Intel jobs, over 3,000 construction jobs, and an additional 3,500 jobs across the state, according to numbers released by the chipmaker.

[Image courtesy: Intel]

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