Cadence and Arm have announced a collaboration aimed at accelerating the innovation of software-defined vehicles (SDVs). This partnership focuses on a chiplet-based reference design and a software development platform targeting advanced driver assistance system (ADAS) applications. The initiative aims to simplify system design and hasten the development process.
Chiplets allow customization of 3D-IC systems for various automotive applications. Nonetheless, ensuring seamless integration among chiplets from different IP providers remains a challenge, alongside the need for a software development platform that allows for earlier starts in the design process, according to the companies.
The partnership’s solution and reference design set a standard for chiplet interface interoperability. Cadence contributed to this solution with its Helium Virtual and Hybrid Studio, Helium Software Digital Twin, I/O IP solutions, and a compute IP portfolio, which includes an advanced AI solution, the Neo neural processing unit (NPU) IP, the NeuroWeave software development kit (SDK) for machine learning (ML) solutions, and DSP compute solutions.
The solution leverages Arm’s latest Automotive Enhanced technologies and Cadence’s intellectual property (IP). It includes a digital twin software stack development platform, compliant with the Scalable Open Architecture for Embedded Edge (SOAFEE) initiative. This approach enables software development to commence in advance of hardware availability, facilitating earlier system integration and validation.
The virtual platform and component IP for the reference platform are currently available for early adopters.
[Image courtesy: Cadence]